| 摘要 |
PROBLEM TO BE SOLVED: To provide, as a power module which cools a power semiconductor element etc., by a cooling device, a power module with a cooling device having a wiring structure that can be made compact as the module while maintaining cooling capability thereof.SOLUTION: The power module with the cooling device 11 exchanges heat between a power component 10 mounted on the cooling device 11 and a refrigerant flowing in a cooling passage 11A in the cooling device 11. The power module includes a block 11B which is provided on one surface orthogonal to a mounting surface of the cooling device 11 for the power component 10 so as to block one side face of the cooling passage 11A, and made of an insulating resin, and a resin layer which is led out of the block 11B so as to crosses in the cooling passage 11A parallel to the mounting surface for the power component 10, and made of an insulating resin. Bus bars P, N, U and W as a power supply line of the power component 10 are led out of the cooling device 11 from the block 11B through inside the resin layer. |
