发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME |
摘要 |
Disclosed are a light emitting device package and a method for fabricating the same. The light emitting device package includes: a trench formed in a substrate; a light emitting structure which is directly grown on a first area of the trench in the substrate; an electrode on the substrate; a wire bonding connecting the electrode with the light emitting structure; and a filler filling the trench.
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申请公布号 |
US2011018021(A1) |
申请公布日期 |
2011.01.27 |
申请号 |
US20100837094 |
申请日期 |
2010.07.15 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM TAE YUN |
分类号 |
H01L33/12;H01L33/00;H01L33/48;H01L33/62 |
主分类号 |
H01L33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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