发明名称 |
METHOD FOR RELEASING A THIN SEMICONDUCTOR SUBSTRATE FROM A REUSABLE TEMPLATE |
摘要 |
The present disclosure relates to methods and apparatuses for releasing a thin semiconductor substrate from a reusable template. The method involves forming a mechanically weak layer conformally on a semiconductor template. Then forming a thin semiconductor substrate conformally on the mechanically weak layer. The thin semiconductor substrate, the mechanically weak layer and the template forming a wafer. Then defining the border of the thin-film semiconductor substrate to be released by exposing the peripheral of the mechanically weak layer. Then releasing the thin-film semiconductor substrate by applying a controlled air flow parallel to said mechanically weak layer wherein the controlled air flow separates the thin semiconductor substrate and template according to lifting forces.
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申请公布号 |
US2011021006(A1) |
申请公布日期 |
2011.01.27 |
申请号 |
US20100826641 |
申请日期 |
2010.06.29 |
申请人 |
SOLEXEL, INC. |
发明人 |
MOSLEHI MEHRDAD M.;WANG DAVID XUAN-QI;TOR SAM TONE;KRAMER KARL-JOSEF |
分类号 |
H01L21/76;B25J15/06;H01L21/677 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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