发明名称 |
WIRING BOARD AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>A wiring board (1000) has: a first rigid wiring board (10) having a housing section (S1); a second rigid wiring board (20) housed in the housing section (S1); and insulating layers (31, 32) which are formed on the first rigid wiring board (10) and the second rigid wiring board (20). The conductor of the first rigid wiring board (10) and the conductor of the second rigid wiring board (20) are electrically connected to each other. The side surface of the second rigid wiring board (20) and/or the wall surface of the housing section (S1) has recesses and protrusions.</p> |
申请公布号 |
WO2011010498(A1) |
申请公布日期 |
2011.01.27 |
申请号 |
WO2010JP58168 |
申请日期 |
2010.05.14 |
申请人 |
IBIDEN CO., LTD.;AOYAMA MASAKAZU;NOGUCHI HIDETOSHI |
发明人 |
AOYAMA MASAKAZU;NOGUCHI HIDETOSHI |
分类号 |
H05K1/14;H05K3/46 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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