发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING SAME
摘要 <p>A wiring board (1000) has: a first rigid wiring board (10) having a housing section (S1); a second rigid wiring board (20) housed in the housing section (S1); and insulating layers (31, 32) which are formed on the first rigid wiring board (10) and the second rigid wiring board (20). The conductor of the first rigid wiring board (10) and the conductor of the second rigid wiring board (20) are electrically connected to each other. The side surface of the second rigid wiring board (20) and/or the wall surface of the housing section (S1) has recesses and protrusions.</p>
申请公布号 WO2011010498(A1) 申请公布日期 2011.01.27
申请号 WO2010JP58168 申请日期 2010.05.14
申请人 IBIDEN CO., LTD.;AOYAMA MASAKAZU;NOGUCHI HIDETOSHI 发明人 AOYAMA MASAKAZU;NOGUCHI HIDETOSHI
分类号 H05K1/14;H05K3/46 主分类号 H05K1/14
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