SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
摘要
PURPOSE: A semiconductor package and a method of fabricating the same are provided to reduce the thickness of a whole package by inserting a second sub-package into the recess part of a first sub-package. CONSTITUTION: A base substrate comprises a first side and a second side which are opposite to each other. A recess part is formed in a second side. A first semiconductor chip(20) is mounted in a first side. A first ball land(16) is arranged in a second side excluding the recess part. A second semiconductor chip comprises a penetration via which is electrically connected to a connection pad. A second ball land is electrically connected to the penetration via.
申请公布号
KR20110008831(A)
申请公布日期
2011.01.27
申请号
KR20090066364
申请日期
2009.07.21
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, JIN HO;YIM, CHOONG BIN;PARK, JIN WOO;CHOI, DAE YOUNG;KIM, MI YEON