| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that includes a process capable of easily and certainly insulating and isolating a plating lead used in a plating treatment process from an electrode in a substrate and a wiring pattern.SOLUTION: The LED lamp 11 includes: the substrate 12; the wiring pattern 17 formed on the substrate 12; and the plating lead 21 for a plating treatment being extended from one end of the wiring pattern 17 and exposing a front end to the outer peripheral surface of the substrate 12. In the LED lamp 11, a common contact 20 connected to the plating lead 21 from one end of the wiring pattern 17, is mounted on the substrate 12, and the plating treatment from the plating lead 21 via the common contact 20 is completed. In the LED lamp, the wiring pattern 17 is isolated electrically from the plating lead 21 by insulating the common contact 20. |
