| 摘要 |
The present invention relates to a method for application of a chip module to an antenna module, wherein antenna contact surfaces formed on an application side (36) of the chip module are contacted with contact surfaces of an antenna disposed on an antenna side of an antenna substrate in an electrically conductive manner, wherein a plurality of chip modules are arranged in a row arrangement on a sheet carrier and the row arrangement is supplied to a separating device arranged at the application location by means of a supply device, the chip module separated from the row arrangement is subsequently positioned on the antenna substrate by means of an application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.
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