| 摘要 |
A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer, cooling the power module substrate, wherein a ratio B/A is in the range defined by 1.55≰B/A≰20, where a thickness of the circuit layer is represented as A, and a thickness of the metal layer is represented as B.
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