ACTIVE PIN CONNECTION MONITORING SYSTEM AND METHOD
摘要
A system for monitoring a connection to an active pin of an integrated circuit (IC) die, includes an input/output (I/O) cell of an IC die, where the I/O cell is bonded to a bonding pad on a ball grid array (BGA) substrate. The system includes a test point on a printed circuit board (PCB) coupled to the bonding pad which forms an electrical/conductive pathway between the test point and the I/O cell. The system includes a clock waveform injected through a resistor into the test point.
申请公布号
WO2011011013(A1)
申请公布日期
2011.01.27
申请号
WO2009US51637
申请日期
2009.07.24
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;SIDDIQUIE, ADNAN, A.;DAI, FANGYONG