| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of an LED having a hollow region for positioning a heat-conducting adhesive, including a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, an electroconductive unit and a mounting unit.SOLUTION: The substrate unit has its substrate body and at least one recessed space formed on a surface of the substrate body. The heat-conducting adhesive unit has at least one heat-conducting adhesive layer positioned in the recessed space of the substrate unit. The light-emitting unit has a plurality of LED dices arranged on the heat-conducting adhesive layer and placed in the at least one recessed space. The electroconductive unit has a plurality of conductive lines and electrically connects each of the plurality of LED dices to the substrate unit. The mounting unit has a transparent mounting colloid, formed on the surface of the substrate body covering the plurality of the LED dices and the plurality of the conductive lines. |
