发明名称 TRANSFER CHAMBER FOR VACUUM PROCESSING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a transfer chamber bottom which may be made thinner than conventional flat bottoms of transfer chambers of comparable size to provide savings in cost and weight.SOLUTION: The transfer chamber 203 for a substrate processing tool 201 includes a body 207 having sidewalls 215 adapted to couple to at least one processing chamber 17 and at least one load lock chamber 15. The body houses at least a portion of a robot 205 adapted to transport a substrate between the processing chamber and the load lock chamber. A lid 227 couples to and seals a top of the body of the transfer chamber. The transfer chamber also has a domed bottom 233 adapted to couple to and to seal a bottom portion of the body of the transfer chamber.
申请公布号 JP2011018923(A) 申请公布日期 2011.01.27
申请号 JP20100196861 申请日期 2010.09.02
申请人 APPLIED MATERIALS INC 发明人 KURITA SHINICHI;BEER EMANUEL;NGUYEN HUNG T;BLONIGAN WENDELL T
分类号 H01L21/677;B65G49/06;B65G49/07;C23C14/56;C23C16/54;H01L21/00;H01L21/02;H01L21/205;H01L21/3065;H01L21/31 主分类号 H01L21/677
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