发明名称 |
TRANSFER CHAMBER FOR VACUUM PROCESSING SYSTEM |
摘要 |
PROBLEM TO BE SOLVED: To provide a transfer chamber bottom which may be made thinner than conventional flat bottoms of transfer chambers of comparable size to provide savings in cost and weight.SOLUTION: The transfer chamber 203 for a substrate processing tool 201 includes a body 207 having sidewalls 215 adapted to couple to at least one processing chamber 17 and at least one load lock chamber 15. The body houses at least a portion of a robot 205 adapted to transport a substrate between the processing chamber and the load lock chamber. A lid 227 couples to and seals a top of the body of the transfer chamber. The transfer chamber also has a domed bottom 233 adapted to couple to and to seal a bottom portion of the body of the transfer chamber. |
申请公布号 |
JP2011018923(A) |
申请公布日期 |
2011.01.27 |
申请号 |
JP20100196861 |
申请日期 |
2010.09.02 |
申请人 |
APPLIED MATERIALS INC |
发明人 |
KURITA SHINICHI;BEER EMANUEL;NGUYEN HUNG T;BLONIGAN WENDELL T |
分类号 |
H01L21/677;B65G49/06;B65G49/07;C23C14/56;C23C16/54;H01L21/00;H01L21/02;H01L21/205;H01L21/3065;H01L21/31 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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