发明名称 CONDUCTIVE PLATE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a conductive plate which is free from damage caused by the pull of a transparent conducting film in a base when the base is curved, and can save a manufacturing cost, and a method for manufacturing the conductive plate.SOLUTION: The conductive plate has the base and a composite structure which is formed on the base and includes the conducting film with electric anisotropy which is arranged on a surface opposite to a surface on which an adhesive layer and the base for the adhesive layer are formed.
申请公布号 JP2011016356(A) 申请公布日期 2011.01.27
申请号 JP20100154705 申请日期 2010.07.07
申请人 CHI MEI ELECTRONICS CORP 发明人 CHANG CHIH-CHIEH;TSAI CHUNG-WEI;WU JEAH-SHENG;CHENG JIA-SHYONG
分类号 B32B7/02;B32B37/20;H01B5/14;H01B13/00;H01R11/01 主分类号 B32B7/02
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