发明名称 |
CONDUCTIVE PLATE AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive plate which is free from damage caused by the pull of a transparent conducting film in a base when the base is curved, and can save a manufacturing cost, and a method for manufacturing the conductive plate.SOLUTION: The conductive plate has the base and a composite structure which is formed on the base and includes the conducting film with electric anisotropy which is arranged on a surface opposite to a surface on which an adhesive layer and the base for the adhesive layer are formed. |
申请公布号 |
JP2011016356(A) |
申请公布日期 |
2011.01.27 |
申请号 |
JP20100154705 |
申请日期 |
2010.07.07 |
申请人 |
CHI MEI ELECTRONICS CORP |
发明人 |
CHANG CHIH-CHIEH;TSAI CHUNG-WEI;WU JEAH-SHENG;CHENG JIA-SHYONG |
分类号 |
B32B7/02;B32B37/20;H01B5/14;H01B13/00;H01R11/01 |
主分类号 |
B32B7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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