| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing apparatus, in which the floor area of a mold is small and which can reduce the size of apparatus as a whole, and by which the utilization efficiency of a resin material is high.SOLUTION: Among electronic components of a substrate 90, at least an electronic component that is located at the forefront is sealed by a resin material filled in upper and lower mold cavities 41 and 61 of upper and lower mold chesses. Next, the upper and lower mold chesses are opened, and the substrate 90 is shifted at a predetermined interval; and the substrate 90 is held by the upper and lower mold chesses again, and at least the second electronic component differing from the electronic component is sealed by the resin material filled inside the upper and lower mold cavities 41 and 61. |
