METHOD FOR PRODUCING SURFACE-MODIFIED COPPER GRAIN, COMPOSITION FOR FORMING CONDUCTOR, METHOD FOR PRODUCING CONDUCTOR FILM, AND ARTICLE

摘要

PROBLEM TO BE SOLVED: To provide a method for producing surface-modified copper grains which can form a conductor film whose volume resistivity is suppressed low compared with the conventional one, to provide copper paste which can form a conductor film whose volume resistivity is suppressed low, and to provide an article having a conductor film whose volume resistivity is suppressed low.SOLUTION: Copper grains are reduced in a reducing agent aqueous solution wherein pH is adjusted to ≤3 and oxidation-reduction potential is adjusted to 100 to 300 mV so as to produce the surface-modified copper grains. The copper paste contains the obtained copper grains and a thermosetting resin. Further, the article has a conductor film obtained by applying the copper paste to a substrate and curing the thermosetting resin.