| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding structure, a wire bonding method and a wire bonding device for achieving loop reduction while preventing the crack-shaped deformation of a neck section.SOLUTION: A wire bonding structure 2 includes a bonding section 10, a wire section 20 and a bond section 22. A neck section 12 of the bond section 10 is made eccentric to a reverse direction side with respect to the wire section 20. The difference in level of the neck section 12 to the reverse direction side is reduced by positively giving eccentricity to the wire section 20 and the neck section 12. Thus, it is possible to reduce stress which is a factor for causing crack-shaped deformation in a reverse operation. |
