| 摘要 |
PROBLEM TO BE SOLVED: To provide a washing liquid for a slurry circulating path and a washing method for the same, which prevents the metal contamination in a silicon wafer due to metal ions eluted from free abrasive grain following washing in an alkaline aqueous solution of free abrasive grain deposited on the inner wall surface of the slurry circulating path.SOLUTION: The slurry circulating path is washed using the washing liquid for the slurry circulating path with added chelating agent to the alkaline aqueous solution of pH 9 or more. Thereby, when washing the free abrasive grain deposited on the inner wall surface of the slurry circulating path in the alkaline aqueous solution, metal contamination in a silicon wafer due to metal ions eluted from the free abrasive grain can be prevented. |
