| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card and a test method capable of efficiently executing the successive test, with respect to the chips formed on a wafer.SOLUTION: The probe card includes a first area group 101 including a plurality of first areas 100, each including a plurality of probes for input pad and probes for output pad, the first areas being arrayed in L rows by M columns (L, M: natural number), according to the chip array of the wafer to be tested; and a second area group 201 including a plurality of second areas 200, each including a plurality of probes for input pad according to the input pad of one chip of the wafer to be tested, with the second areas being arrayed in (L×N) rows by M columns (N: natural number) or L rows (M×N) columns according to the chip array; and the first area group 101 and the second area group 201 are connected continuously in a column direction according to the chip array, such that the first areas 100 and the second areas 200 constitute an area array of {L+(L×N)} rows by M columns, when the second area group 201 includes the array in (L×N) rows by M columns. |
