发明名称 Hot melt pressure sensitive adhesives for paper labels
摘要 <p>A HMPSA is provided that preferably includes at least a) from 30 to 50% of a mixture of triblock and diblock styrenic copolymers having an overall styrene content comprised between 14 and 40%, b) from 40 to 55% of a tackifying resin with a softening temperature comprised between 70 and 150° C. obtainable by hydrogenating, polymerizing or copolymerizing mixtures of aliphatic unsaturated hydrocarbons having about 5, 9 or 10 carbon atoms; c) from 4 to 20% of a hydrocarbon oil with an aromatic content less than 15%; d) from 1 to 6% of a filler selected among calcium carbonate or a low molecular weight homopolymer or copolymer of polyethylene. A laminated system is also provided that includes at least an adhesive layer utilizing the HMPSA and paper facestock. Also included are PSA labels obtainable from the laminated system with a reduced tendency to discolor after storage.</p>
申请公布号 AU2007338452(B2) 申请公布日期 2011.01.27
申请号 AU20070338452 申请日期 2007.12.14
申请人 BOSTIK S.A. 发明人 DAVID GOUBARD;ROBERT JOHN HAEGER
分类号 C09J153/02;C08L53/02 主分类号 C09J153/02
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