| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder capable of suppressing an increase in weight even when the number of tools is increased.SOLUTION: Rotary bodies which move respective tools 81 supported rotatably, between a pickup point and a bonding point, are sectioned into first rotary bodies 83 constituting a first group and second rotary bodies 84 constituting a second group. Arrangements of the respective tools 81 of the respective groups are so set that in a state wherein the tools 81 belonging to one of the first group and second group are moved to the pickup point 51, the tools 81 belonging to other group are moved to the bonding point. The die bonder is provided with a first rotating mechanism 171 which rotates the tools 81 belonging to the first group and a second rotating mechanism 321 which rotates the tools 81 belonging to the second group. |
