发明名称 SURFACE-MOUNTED LIGHT-EMITTING DIODE ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a surface-mounted LED element allowing light extraction efficiency of the overall element to be improved by reducing the thickness of a phosphor-mixed layer to minimize loss of energy of light emitted from an LED chip and permeating the phosphor-mixed layer.SOLUTION: The surface-mounted LED element is formed by including: a package which houses one or more pairs of electrodes inside, and is formed by having a predetermined space at the center, and having an emitting window opened to emit light; a lens which is formed on the package to cover the emitting window; the LED chip mounted on the electrodes inside the package; wires for electrically connecting the LED chip to the electrodes; and the phosphor-mixed layer which is formed on the surface of the lens adjacent to the emitting window.
申请公布号 JP2011018949(A) 申请公布日期 2011.01.27
申请号 JP20100242786 申请日期 2010.10.28
申请人 SAMSUNG LED CO LTD 发明人 CHAE JOON-SEOK;BAEK JONG HWAN
分类号 H01L33/50;H01L33/56;H01L33/58;H01L33/60;H01L33/62 主分类号 H01L33/50
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