发明名称 |
SURFACE-MOUNTED LIGHT-EMITTING DIODE ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounted LED element allowing light extraction efficiency of the overall element to be improved by reducing the thickness of a phosphor-mixed layer to minimize loss of energy of light emitted from an LED chip and permeating the phosphor-mixed layer.SOLUTION: The surface-mounted LED element is formed by including: a package which houses one or more pairs of electrodes inside, and is formed by having a predetermined space at the center, and having an emitting window opened to emit light; a lens which is formed on the package to cover the emitting window; the LED chip mounted on the electrodes inside the package; wires for electrically connecting the LED chip to the electrodes; and the phosphor-mixed layer which is formed on the surface of the lens adjacent to the emitting window. |
申请公布号 |
JP2011018949(A) |
申请公布日期 |
2011.01.27 |
申请号 |
JP20100242786 |
申请日期 |
2010.10.28 |
申请人 |
SAMSUNG LED CO LTD |
发明人 |
CHAE JOON-SEOK;BAEK JONG HWAN |
分类号 |
H01L33/50;H01L33/56;H01L33/58;H01L33/60;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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