摘要 |
PROBLEM TO BE SOLVED: To provide a less expensive substrate-storing container that reduces hygroscopicity and moisture permeability and can prevent substrates from organic contamination.SOLUTION: The substrate-storing container includes a front-opening box type container body 1 in which a plurality of semiconductor wafer sheets are stored in an ordered manner, and a lid 20 which is detachably fitted to the opened front face 6 of the container body 1 through a gasket for sealing. The container body 1 and the lid 20 are individually formed by injection-molding a molding material comprising a synthetic resin which has a water absorptivity of 0.1% or less and shows a total outgas amount, measured by the dynamic headspace method (heating for 24 hours at 80°C), of 15 ppm or less. The synthetic resin in the molding material comprises at least one member selected from among a cycloolefin polymer, a liquid crystal polymer, a polyether ether ketone, polybutylene terephthalate and polyethylene terephthalate, or an alloy resin thereof. |