| 摘要 |
<p>Provided is a semiconductor wafer separation mechanism capable of separating semiconductor wafers one wafer at a time, with which it is possible to resolve the problem that manually separating semiconductor wafers causes the wafers to crack and/or break, reducing yield. The semiconductor wafer separation mechanism comprises: a wafer separation-facilitating tank for separating semiconductor wafers; a wafer mounting base comprising a plate provided with three separate stoppers for positioning a semiconductor wafer; a stopper to which the wafer mounting base is attached, said stopper being attached to a stopper height adjustment mechanism that adjusts the height of the stopper; a feed roller disposed above the stopper on the side of the wafer-supporting base; and an auxiliary roller disposed between the feed roller and the stopper.</p> |
