LASING-FREE PACKAGE METHODS FOR SEMICONDUCTOR OPTICAL AMPLIFIER (SOA) DIE

摘要

Lasing-free package methods for a semiconductor optical amplifier (SOA) die (2) are disclosed. The methods include: pasting a pad at a front end of the die component, and pasting a ?/4 wave plate rotated byf=45 º onto the pad with certain areas overlapped, which makes it possible that the wave plate can completely cover the light-emitting region of the die (2), and then baking and curing; or pasting a Faraday rotator onto an element attaching member (3) directly. The methods allow that the polarization state of the reflected light is oriented orthogonal to the polarization state of the light emitted by the die (2), and ensure the die (2) lasing-free. The methods can be applicable to the packages for single-polarization SOA dies (2), single-polarization semiconductor optical amplifier reflective electro-absorption modulator (SOA-REAM) dies and single-polarization super-luminescent semiconductor photodiode dies.