摘要 |
<p>The method involves embedding all components required for assembly of transponders in a ceramic carrier substrate (2) to obtain a ceramic module, where the module has inertness and temperature resistance up to 500 degrees centigrade. The substrate is made of a material e.g. zirconium oxide and oxides or nitrides formed from an element of second and third main groups of period systems. Electrically conductive structures e.g. antennas (3), are arranged on the substrate. The antennas are formed from pyrolytic graphite, metallic compounds, pure metal or alloy.</p> |