发明名称 SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent the metal powder attached to a conductive cap part from attaching to a surface acoustic wave device and to significantly improve airtightness by coating an entire surface of a conductive cap member with a sealing material at its base member side. SOLUTION: A surface acoustic wave device 2 is sealed into a package, where a base member 1 of a recessed part shape consisting of the ceramic such as alumina is bonded to a plate-like metallic cap member 3. The device 2 is fixed onto the top surface of the recessed part of the member 1 by means of an adhesive (die-bonding agent) and a wire (lead wire) 5 is connected to a prescribed electrode of the member 1 with wire bonding. The member 1 is bonded to the member 3 via the adhesion of a sealing material (resin adhesive) 7. The member 7 is formed in advance over the entire surface of the member 3 at the side of the member 1. Then a rectangular frame part formed on the top surface of the member 1 is adhered to the outer circumference part of the member 3 by the material 7.
申请公布号 JP2000357937(A) 申请公布日期 2000.12.26
申请号 JP19990170960 申请日期 1999.06.17
申请人 MURATA MFG CO LTD 发明人 HIGUCHI MASATO;HIRAKAWA ATSUSHI;UESUGI SHINOBU;JINRYO KOICHI
分类号 H03H9/25;H03H3/08;H03H9/05;H03H9/10;(IPC1-7):H03H9/25 主分类号 H03H9/25
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