发明名称 |
SURFACE ACOUSTIC WAVE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To prevent the metal powder attached to a conductive cap part from attaching to a surface acoustic wave device and to significantly improve airtightness by coating an entire surface of a conductive cap member with a sealing material at its base member side. SOLUTION: A surface acoustic wave device 2 is sealed into a package, where a base member 1 of a recessed part shape consisting of the ceramic such as alumina is bonded to a plate-like metallic cap member 3. The device 2 is fixed onto the top surface of the recessed part of the member 1 by means of an adhesive (die-bonding agent) and a wire (lead wire) 5 is connected to a prescribed electrode of the member 1 with wire bonding. The member 1 is bonded to the member 3 via the adhesion of a sealing material (resin adhesive) 7. The member 7 is formed in advance over the entire surface of the member 3 at the side of the member 1. Then a rectangular frame part formed on the top surface of the member 1 is adhered to the outer circumference part of the member 3 by the material 7.
|
申请公布号 |
JP2000357937(A) |
申请公布日期 |
2000.12.26 |
申请号 |
JP19990170960 |
申请日期 |
1999.06.17 |
申请人 |
MURATA MFG CO LTD |
发明人 |
HIGUCHI MASATO;HIRAKAWA ATSUSHI;UESUGI SHINOBU;JINRYO KOICHI |
分类号 |
H03H9/25;H03H3/08;H03H9/05;H03H9/10;(IPC1-7):H03H9/25 |
主分类号 |
H03H9/25 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|