| 摘要 |
The present invention describes a backsheet (10) for electronic devices comprising at least a heat resistant layer (12c) reactive and attached with a PolyOlefine based tie-layer(s) (12b) provided at the side facing the active material (4) to be encapsulated. Optionally further layer(s) (12a) are provided on top of layer (12b), being Flexible PolyPropylene and/or (co-)PE based layer(s). Optionally a last layer (13b) is provided facing the active material (4) based on (co-)PE based tie-layer (13b), such layer providing good adhesion directly on the back-side of the active material (4), or attached barrier layers. |
