发明名称
摘要 <p>&lt;P&gt;PROBLEM TO BE SOLVED: To achieve sufficient polishing speed while suppressing generation of scratches. Ž&lt;P&gt;SOLUTION: An average particle diameter of polishing particles is 5-200 nm, specifically preferable in 10-120 nm. The polishing particles have 500-4500 N/mm&lt;SP&gt;2&lt;/SP&gt;of a 10% compression elastic modulus, specifically preferable in 1000-4000 N/mm&lt;SP&gt;2&lt;/SP&gt;. In the case that the 10% compression elastic modulus is less than 500 N/mm&lt;SP&gt;2&lt;/SP&gt;, the polishing particles are too soft not to obtain a sufficient polishing speed. In the case that it exceeds 4500 N/mm&lt;SP&gt;2&lt;/SP&gt;, the particles are too hard, the polishing speed is fast, the scratches residually exist, and newly generate, so smoothness of a polishing face is insufficient. Ž&lt;P&gt;COPYRIGHT: (C)2004,JPO&amp;NCIPI Ž</p>
申请公布号 JP4618974(B2) 申请公布日期 2011.01.26
申请号 JP20020374410 申请日期 2002.12.25
申请人 发明人
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
代理机构 代理人
主权项
地址