| 摘要 |
A semiconductor device 11 includes a housing 12, which is formed of a polyamide-series thermoplastic resin, and semiconductor package 13 sealed in the housing 12, which is formed of a thermosetting epoxy resin. The package 13 has a modified face 13a that is modified by UV-irradiation to have adhesive properties to polyamide. A plurality of connector terminals 14 extend from the packages 13 in parallel. A portion of the terminals 14 is also sealed in the housing 12 together with the package 13. Thus, the device 11 is easily produced by insert molding and has excellent moisture resistance. |
