发明名称
摘要 PROBLEM TO BE SOLVED: To obtain a novel epoxy compound having a lower melting temperature which can serve as a raw material for an epoxy resin cured product exhibiting liquid crystallinity. SOLUTION: The epoxy compound is represented by formula (1) (wherein Ar<SP>1</SP>, Ar<SP>2</SP>and Ar<SP>3</SP>are the same or different and are each either one of divalent groups represented by formula (2); (m) is an integer of 1-9; R is hydrogen atom, or the like; (a) is an integer of 1-8; (b), (e) and (g) are each an integer of 1-6; (c) is an integer of 1-7; (d) and (h) are each an integer of 1-4; (f) is an integer of 1-5; R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>, R<SP>4</SP>, R<SP>5</SP>and R<SP>6</SP>are the same or different and are each hydrogen atom, or the like; Q<SP>1</SP>and Q<SP>2</SP>are the same or different and are each a 1-9C linear alkylene group). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP4619770(B2) 申请公布日期 2011.01.26
申请号 JP20040370731 申请日期 2004.12.22
申请人 发明人
分类号 C07D301/28;C08G59/02;C07D303/27;C08G59/24;C08J5/24;C08L63/00 主分类号 C07D301/28
代理机构 代理人
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