发明名称 Nitride semiconductor substrate and method of producing same
摘要 <p>A nitride semiconductor substrate having a rugged surface being lapped by whetting granules to roughness between Rms5nm and Rms200nm, which has a function of reducing dislocations of a GaN, InGaN or AlGaN layer epitaxially grown on the lapped substrate by gathering dislocations in the epi-layer to boundaries of holes, pulling the dislocations to bottoms of the holes. Higher roughness of the nitride substrate degrades morphology of an epitaxially-grown layer thereon but reduces dislocation density to a lower level. Morphology of the epi-layer contradicts the dislocation density of the epi-layer. The nitride semiconductor substrate can reduce dislocation density and can be low cost and useful substrates. </p>
申请公布号 EP1521310(A3) 申请公布日期 2011.01.26
申请号 EP20040021388 申请日期 2004.09.08
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 IRIKURA, MASATO;MOCHIDA, YASUSHI;NAKAYAMA, MASAHIRO
分类号 C30B25/18;C30B29/38;C30B29/40;H01L21/02;H01L21/20;H01L21/205;H01L21/304;H01L33/00;H01L33/22 主分类号 C30B25/18
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