| 摘要 |
PROBLEM TO BE SOLVED: To provide a means of preventing short circuits among neighboring external interconnect members, concerning a method for manufacturing a semiconductor device which has a columnar electrode which connects to a wiring layer arranged on a semiconductor element on one end and has external interconnect members arranged on the other end. SOLUTION: A method comprises a process for forming a wiring layer 24 on a semiconductor substrate 21 (22); a process for forming an electrode resist 43, having an opening to expose a columnar electrode 25A on the wiring layer 24 and forming the columnar electrode 25A, thicker than the electrode resist 43, in the opening with copper (Cu) by using the electrode resist 43; a process for forming a sealing resin 28 on the semiconductor substrate 21 (22), after stripping the electrode resist 43; and a process for reducing the thickness of the sealing resin 28. COPYRIGHT: (C)2008,JPO&INPIT |
