| 摘要 |
The present invention relates to a process for depositing a metal coating containing nickel and boron on a substrate, said process comprising the steps of: preparing a plating bath having a pH in the range of about 10.5 to 14 and a temperature above ambient temperature, comprising: (a) nickel ions according to a nickel concentration in the range of about 4.76 to about 5 g/l of coating bath; (b) an effective amount of a stabilizer; (c) a metal ion complexing agent in an amount effective to inhibit precipitation of said metal ions from the plating bath; (d) an effective amount of a borohydride reducing agent; and (e) optionally up to 0.25 moles of cobalt per liter of plating bath; immersing said substrate to be coated into said bath, such electrolessly depositing the coating on the substrate and optionally heat treating said metal coating for about one to about 24 hours subsequently. The process according to the present invention is characterized in that the plating bath is prepared on the basis of deionized water having a conductivity in the range of about 0.05 to about 0.1 mu S. Furthermore, the present invention relates to a plating bath for use in said process, and to a coated article as manufactured by means of such a process. |
