| 发明名称 |
A SUB-ASSEMBLY FOR USE IN FABRICATING PHOTO- ELECTROCHEMICAL DEVICES AND A METHOD OF PRODUCING A SUB-ASSEMBLY |
| 摘要 |
<p>A sub assembly is disclosed for use in fabrication of photo-electrochemical devices including: a first layer which includes a semiconductor material; a second layer which is electrically conductive; and wherein the second layer supports the first layer. Methods of producing the sub assembly are also disclosed.</p> |
| 申请公布号 |
EP2277184(A1) |
申请公布日期 |
2011.01.26 |
| 申请号 |
EP20090714274 |
申请日期 |
2009.02.25 |
| 申请人 |
DYESOL LTD |
发明人 |
BELLON, OLIVIER;TULLOCH, SYLVIA, MEDLYN |
| 分类号 |
H01G9/20;H01L21/64;H01L31/18 |
主分类号 |
H01G9/20 |
| 代理机构 |
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