| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a film pattern forming method and a method for manufacturing a surface acoustic wave device in which a portion of a liquid droplet for forming a film pattern to cover the area not to be treated can be restrained from being stuck to the area to be treated and to realize the surface acoustic wave device, a surface acoustic wave oscillation device and electronic equipment. <P>SOLUTION: The film pattern forming method and the method for manufacturing the surface acoustic wave device are characterized in that a discharge nozzle 4 is not opposed to an IDT (Inter Digital Transducer) 44 being an application-prohibited area at a discharging/scanning step of discharging the liquid droplet of an anodic oxidation resist film material toward a wafer 1 from the discharge nozzle 4 during the time to continuously move the discharge nozzle relatively to the wafer 1 without changing the moving direction. The surface acoustic wave oscillation device has the surface acoustic wave device manufactured by the method. The electronic equipment has the surface acoustic wave oscillation device. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
