| 摘要 |
PROBLEM TO BE SOLVED: To prevent a pickup from deforming, when absorbing a solder ball. SOLUTION: A method for supplying a solder ball comprises an absorption process for making a solder ball 1 absorbed to an absorption hole provided in an absorption plate of a pickup head 5, by putting the inside of the pickup head 5 in a pressure-reduced state, a conveyance process for conveying the pickup head 5 that has absorbed the solder ball 1 onto a substrate, and a mounting process for mounting the absorbed solder ball 1 on the substrate. The absorption process has a first pressure-reducing process and a second pressure-reducing process: the first pressure reducing process is a process for reducing the pressure in the pickup head 5 using a vacuum pump 10, and the second pressure reducing process is a process for preventing the inside of the pickup head 5 from being reduced below a predetermined pressure, by reducing the inside thereof using the vacuum pump 10, while making pressure adjustment means. Before the solder balls 1 are absorbed by all the absorption holes in the absorption plate, transition is caused to take place, from the first pressure-reducing process to the second pressure-reducing process. COPYRIGHT: (C)2005,JPO&NCIPI
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