ADHESIVE COMPOSITION AND CONNECTION STRUCTURE

摘要

PURPOSE: An adhesive composition and a connection structure for a circuit member using the adhesive composition are provided to obtain excellent adhesive strength in a curing condition of short time and low temperature and to maintain stable performance after a reliability test for a long time. CONSTITUTION: An adhesive composition includes: a thermoplastic resin; a radical polymeric compound; a branched polymer formed by polymerizing a compound represented by A-R^20-(B)_X, a branched polymer formed by polymerizing at least two kinds of compounds represented by A-R^20-(B)_X, R^21-(A)_2 and R^21-(B)_2, or a branched polymer formed by polymerizing at least two kinds of compounds represented by A-R^20-(B)_X, R^22-(A)_2 and R^22-(B)_2; and a radical polymerization initiator.