METHOD AND APPARATUS FOR REMOVING RESIST FILM

摘要

PROBLEM TO BE SOLVED: To provide a resist film removing method and resist film removing apparatus which can make the removal of a resist film from a substrate more certain by promoting the delamination of the resist film from the substrate and can suppress the reattachment of the substrate and the resist film delaminated from the substrate. SOLUTION: Steam is made to advance into the closely-attached interface between a semiconductor wafer 5 and the resist film 6 via cracks generated in the resist film 6 to float the resist film 6 from the semiconductor wafer 5. At the same time, a delaminating part of the resist film 6 which has begun to delaminate from the closely-attached interface is vibrated by a vibration generator 8 to completely delaminate the resist film 6 from the semiconductor wafer 5. COPYRIGHT: (C)2006,JPO&NCIPI