发明名称 CUTTING METHOD OF SUBSTRATE AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a device for cutting a circuit board which does not require a complicated and expensive device, is simple in structure and inexpensive, and has excellent workability and high cutting efficiency, and to provide a method of cutting the circuit board. SOLUTION: A rear anchor portion of a substrate A set on a pair of guide rails 31, 31 is held by a pair of holders 41, 41 attached to a substrate carrying device, then the substrate A is retracted along the guide rails 31, 31 so that the cutting region of the substrate A corresponds to a predetermined cutting position Y of a substrate cutting mechanism, and then the rotational blade 51 is moved along the cutting position Y of the substrate A to cut the substrate A. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006229179(A) 申请公布日期 2006.08.31
申请号 JP20050158774 申请日期 2005.05.31
申请人 SAYAKA:KK 发明人 KODAIRA KAZUNORI;WATANABE NOBUYUKI;GINOZA TSUGUYORI
分类号 H05K3/00 主分类号 H05K3/00
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