发明名称 Manufacturing method for single chip COB USB devices with optional embedded LED
摘要 According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.
申请公布号 US7874067(B1) 申请公布日期 2011.01.25
申请号 US20080137432 申请日期 2008.06.11
申请人 SUPER TALENT ELECTRONICS, INC. 发明人 HIEW SIEW S.;YU FRANK I-KANG;NAN NAN;HSUEH PAUL;MA ABRAHAM C.;SHEN MING-SHIANG
分类号 H05K3/30;G06F13/36 主分类号 H05K3/30
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