发明名称 |
Manufacturing method for single chip COB USB devices with optional embedded LED |
摘要 |
According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.
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申请公布号 |
US7874067(B1) |
申请公布日期 |
2011.01.25 |
申请号 |
US20080137432 |
申请日期 |
2008.06.11 |
申请人 |
SUPER TALENT ELECTRONICS, INC. |
发明人 |
HIEW SIEW S.;YU FRANK I-KANG;NAN NAN;HSUEH PAUL;MA ABRAHAM C.;SHEN MING-SHIANG |
分类号 |
H05K3/30;G06F13/36 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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