| 摘要 |
<p>Disclosed is an epoxy resin composition exhibiting excellent fluidity, while having heat resistance and low thermal expansion. The epoxy resin composition is useful for semiconductor encapsulating material, molding material, lamination material, powder material, adhesive material and the like. The epoxy resin composition contains an epoxy resin, a curing agent for epoxy resins and an inorganic filler. An epoxy resin having a diepoxyethylbenzene structure is used as the epoxy resin, and this epoxy resin contains not less than 90% by weight of 1,3-disubstituted derivatives and 1,4-disubstituted derivatives of an epoxyethyl group, while having a viscosity at 25°C of not more than 50 mPa · s. A polyvalent hydroxy compound is used as the curing agent for epoxy resins.</p> |
