发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
<p>The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.</p> |
申请公布号 |
KR20110008107(A) |
申请公布日期 |
2011.01.25 |
申请号 |
KR20107029697 |
申请日期 |
2001.02.15 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
INADA TEIICHI;SUMIYA KEIJI;TOMIYAMA TAKEO;IWAKURA TETSUROU;KAWAKAMI HIROYUKI;SUZUKI MASAO;MATSUZAKI TAKAYUKI;HOSOKAWA YOUICHI;HATAKEYAMA KEIICHI;SHIMADA YASUSHI;TANAKA YUUKO;KURIYA HIROYUKI |
分类号 |
C09J163/00;C08G59/18;C09J11/00;C09J133/14;H01L21/58;H01L23/14;H01L23/29;H01L23/31 |
主分类号 |
C09J163/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|