| 摘要 |
PURPOSE: A lead frame and a mold for packaging a semiconductor, and a method for packaging the semiconductor are provided to increase production yield by preventing the generation of a flash. CONSTITUTION: A plurality of first chip pedals(111, 112, 113, 114) are arranged in a straight line and a semiconductor chip is mounted therein. A plurality of second chip paddles are parallel with the first chip pedals and semiconductor chip is mounted therein. A middle connection lead(130) connects one side of a plurality of first chip pedals to one side of a plurality of chip pedals. A plurality of first outer leads are spaced by a first chip pedal unit and has a separation space. A plurality of second outer leads are spaced by a second chip pedal unit and has a separation space. |
