发明名称 Semiconductor apparatus and method for manufacturing the same
摘要 It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips.
申请公布号 US7875481(B2) 申请公布日期 2011.01.25
申请号 US20080200177 申请日期 2008.08.28
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ONOZUKA YUTAKA;YAMADA HIROSHI;FUNAKI HIDEYUKI;ITAYA KAZUHIKO
分类号 H01L21/00 主分类号 H01L21/00
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