| 摘要 |
PURPOSE: A resin composition is provided to ensure use for a solder resist with excellent adhesion to copper wiring and high desmear resistance. CONSTITUTION: A resin composition comprises an epoxy resin, triazine structure-containing novolac type phenol resin, imidazole derivatives and/or cyclic amidine derivatives, and further inorganic filler. The epoxy resin includes an epoxy resin which has two or more epoxy groups in one molecule and is liquid at 20 °C; and/or an aromatic epoxy resin which has three or more epoxy groups in one molecule, has 250 or less of epoxy equivalent, and is a solid phase at 20 °C. |
