| 摘要 |
<p>PURPOSE: A semiconductor manufacturing apparatus having an improved wafer transferring device is provided to improve the productivity of a semiconductor by making the contact area between a wafer and a blade minimum to prevent the wafer form being scratched. CONSTITUTION: A robot blade(10) transfers a wafer to a certain location to manufacture a semiconductor. The blade has a certain area to maintain the wafer stable. A plurality of contacts(12,13,14,15) are protruded from a wafer holder to make a contact area with the wafer minimum. Contacts have an inclined plane with a certain angle outwardly from the center of wafer holder.</p> |
