| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus achieving high packaging density.SOLUTION: The electronic apparatus for achieving high packaging density includes: a housing 20; a circuit board 201 housed in the housing 20 and having one surface and the other surface on the opposite side from the one surface; a surface mounting component 202 mounted on the one surface of the circuit board 201; and a reinforcing material 202A facing the surface mounting component 202, printed on the other surface of the circuit board 201 and reinforcing a mounting region of the surface mounting component. |
