发明名称 |
PLATING STRUCTURE AND METHOD FOR MANUFACTURING ELECTRIC MATERIAL |
摘要 |
There is provided a plating structure obtained by heat-treating a silver-plated structure obtained by forming a tin-plated layer, an indium-plated layer, or a zinc-plated layer, having a thickness of 0.001 to 0.1μm, on a surface of the silver-plated layer formed on a surface of a plating base. There is also provided a coating method for obtaining the plating structure which comprises the step of melting a particle deposit spottedly deposited at 2×10−6 to 8×10−6 g/cm2 such that the spot-deposited particles have gaps therebetween as viewed above and the particles each having an average diameter of 20 to 80 nm do not pile up in a direction perpendicular to the surface of the silver layer to obtain a film. |
申请公布号 |
US2011012497(A1) |
申请公布日期 |
2011.01.20 |
申请号 |
US20100835362 |
申请日期 |
2010.07.13 |
申请人 |
KYOWA ELECTRIC WIRE CO., LTD. |
发明人 |
SUMIYA YOSHINORI;SUGIE KINYA |
分类号 |
H01J5/16;B05D3/02;B32B15/01 |
主分类号 |
H01J5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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