发明名称 METHOD FOR COUPLING OF A PRIMARY HEAT PUMP SYSTEM INTENDED FOR HEATING A BUILDING AND/OR HEATING OF TAP WATER TO ONE OR MORE SECONDARY HEAT PUMP SYSTEMS INTENDED FOR LOWER THE TEMPERATURE IN AN ENCLOSED SPACE AND DEVICE FOR CARRYING OUT THE METHOD
摘要 <p>The present invention relates to a method for coupling a primary heat pump system intended for heating a building by means of the heating of heating water via a heating water circuit and/or for heating hot tap water via a tap water circuit, wherein the primary heat pump system is provided with at least one primary cooling agent circuit, comprising at least one primary evaporator (3a), primary compressor (3b), primary expansion provision (3d) and a primary condenser (3c), on one or more secondary heat pump systems intended for lowering the temperature in a closed space of a housing, such as for instance a refrigerator, wherein the secondary heat pump system is provided with at least one secondary cooling agent circuit comprising at least one secondary evaporator (4a), secondary compressor (4b) and secondary expansion provision (4c), wherein the heat extracted from the closed space by the secondary heat pump system is used to additionally heat the heating water or tap water, and wherein the primary and secondary heat pumps are enclosed in the housing. The invention also relates to a device for performing the method.</p>
申请公布号 WO2011008089(A1) 申请公布日期 2011.01.20
申请号 WO2010NL50451 申请日期 2010.07.12
申请人 PINAS, ERNEY ERROL 发明人 PINAS, ERNEY ERROL
分类号 F25B5/02;F25B29/00 主分类号 F25B5/02
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