METHOD FOR MANUFACTURING PLATED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for forming the electroless plating on a substrate consisting of a compound containing Zn with excellent adhesiveness.SOLUTION: A substrate 11 consisting of a compound containing Zn is immersed in a solution of copper sulfate to deposit a Cu thin film 12 on the substrate 11. Thereafter, the electroless plating is started while bringing a metal having the ionization tendency higher than Cu into contact with the substrate 11 on which the Cu thin film 12 is deposited thereon, and an electroless plating film 13 is formed thereon.