摘要 |
Problem to be Solved by the Invention: To provide a adhesive tape for electronic component fabrication, having extremely high antistatic performance, superior adherence between an antistatic layer and a adhesive layer, does not cause corrosion of a magnetic head that is comprised of a metal such as pure copper or the like, and alumina to occur, and which is easier to be released again. Means for Solving the Problem: The provided adhesive tape for electronic component fabrication in accordance with the present invention comprises: a base material film (3); and a adhesive layer (7), wherein an antistatic layer (5) which is comprised of an electrically conductive polymer is formed on one side or both sides of the base material film (3), the adhesive layer (7) is a radiation curable type, which has a copolymer of an acrylic system as a principal ingredient, each containing at least a radiation curable carbon-carbon double bond containing group, a hydroxyl group and a carbonyl group, that are individually attached to a principal chain, and which has a gel fraction higher than or equal to sixty percent.
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